NeoSiP

What is NeoSiP?

The NeoSiP project, framed within the AEI support programme, seeks to research and develop new System-in-Package architectures aimed at high-value technology applications.

The project focuses on Industrial Research activities related to SIP (System in Package) architectures and technologies. This study is based on technical and feasibility analyses of these architectures applied to three key industries within the Spanish ecosystem: Healthcare, IoT and Automotive. The aim is to create the basis for Spanish industry to develop its own capacity in the development of heterogeneous SIP devices.

Project objectives:

• Definition of Requirements and Architectures: Define the requirements, architectures, interfaces and minimum blocks required for each use case in the areas of Healthcare, IoT and Automotive.
• Research into Heterogeneous Packaging Solutions: Research heterogeneous packaging solutions that optimise the competitive position of Spanish industry and improve its technological independence.
• SiP Models and Simulations: Define and generate models and simulations of SiP solutions that allow a rapid assessment of competitive advantages for the generation of new products.
• Design Guidelines for Heterogeneous SiP Devices: Generate general macro-level design guidelines for heterogeneous SiP devices to facilitate future developments.